BGA adopts the wafer multi-layer Die high-density packaging form, higher storage density per unit area, high transmission efficiency, high performance, high reliability, low transmission delay. Compared with the traditional TSOP package, the volume is smaller, and the heat dissipation and electrical performance are better. Our company has achieved 32 layers of precision die stacking process, can provide a single BGA capacity of 1TB-4TB products.
Package form: BGA132 / BGA152
Wafer type: MLC / TLC / QLC
Product dimensions: 12 X 18mm / 14 X 18mm
Product capacity: 2GB-2TB
Operating temperature: 0℃ ~ 70℃ / -40℃ ~ 85℃
Application areas: Mobile storage devices, SSD solid state drives, embedded devices, enterprise storage, data centers, etc.