Following JEDEC 5.0/5.1 standards, highly integrated BGA packaged products using high-performance eMMC controllers and high-quality NAND flash memory significantly reduce the storage management load on the host processor eMMC is mainly used in the Internet of Things field such as smartphones, tablets, smart TVs, game consoles, set-top boxes, and in-vehicle multimedia terminals。
Package form: FBGA153
Product dimensions: 11.5mm*13mm*1.0mm
Product capacity: 4GB-512GB
Operating temperature: 0℃ to +85℃ / -25℃ to 85℃
Product speed: 100-400MB/S
Operating voltage: 1.8V/3.3V
Interface protocol: eMMC 5.0/5.1
Flash media: MLC/TLC/QLC
Product advantages: Supports LDPC ECC error correction, wear leveling, and bad block management functions，Embedded/mobile application intelligent algorithms，Supports in-field firmware updates (FFU)，Dynamic power management technology，Provides compatibility with high-speed storage card interfaces compatible with JEDEC 5.0/5.1 versions，Highly integrated packaging, large storage density, high reliability