The UDP (USB Disk in Package) adopts a latest processing technology called PIP packaging, which integrates PCB board assembly and semiconductor packaging processes to directly encapsulate the UDP （U disk）. PIP packaging has advantages such as waterproof, shockproof, anti-static, and high temperature resistance, making it the preferred choice for digital storage solutions.
Package form: PIP packaging
Swafer type: SLC / MLC / TLC / QLC
Product dimensions: 24.8mm X 11.3mm X 1.5mm
Product capacity: 128MB ~ 512GB
Operating temperature: 0℃ ~ 70℃ / -40℃ ~ 85℃
Operating voltage: 5V
System compatibility: Plug and play, perfect compatibility with multiple ，systems and devices
Specification compatibility: Supports USB 2.0 / compatible with USB 1.1
Product advantages: Portable storage, easy to carry，Plug and play, convenient to use ， Fast data transfer speed, strong compatibility